大会日程

• 主题演讲 Keynote

  主席：芯和半导体科技（上海）股份有限公司  创始人&总裁  代文亮 Chairman: Wenliang Dai,Founder and President, Xpeedic Co.,Ltd
  09:30-09:50	签到及入场 Registration and Networking
  09:50-10:00	致辞 Welcome	中国半导体行业协会   副秘书长兼封测分会秘书长  徐冬梅 Dongmei Xu, Deputy Secretary-General and Secretary-General of the Closed Testing Branch, China Semiconductor Industry Association
  10:00-10:25	高算力AI应用下，异构集成系统的机遇与挑战 Heterogeneous Integration Systems for High-Computational AI Applications	芯和半导体科技（上海）股份有限公司  创始人&总裁  代文亮 Wenliang Dai, Founder and President, Xpeedic Co., Ltd.
  10:25-10:50	UCIe 2.0：推动开放芯粒生态的演进和创新 UCIe 2.0: Driving the evolution and innovation of an open core ecosystem	阿里云智能集团  首席云服务器架构师和研发总监，CXL和UCle董事会成员  陈健   Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIeTM
  10:50-11:15	通向个人大模型之路 The Road to Personal Large Models	上海燧原科技股份有限公司   首席芯片战略官   周强 Alex Zhou，Chief Chip Strategy Officer，Shanghai Enflame Technology Co., Ltd
  11:15-11:40	利扬芯片一体两翼战略服务产业发展 Liyang chip integrated two wings strategic service industry development	广东利扬芯片测试股份有限公司  总经理  张亦锋 Yeefeng Zhang, General Manager, Guangdong Liyang Chip Testing Co.,  Ltd, President, Dongguan Integrated Circuit Industry Association
  11:40-12:05	异质整合的创新与发展  Packaging Innovation & Future by Heterogeneous Integration	日月光半导体制造股份有限公司  资深副总  陈光雄 Scott Chen, Sr. Vice President, ASE Technology holding Co.Ltd
  12:05-12:30	全球及中国半导体市场数据解读 Interpretation of Global and Chinese Semiconductor Market Data	SEMI  半导体事业发展部总监  顾文昕 Wenxin Gu, Director of Semiconductor Business Development, SEMI
  12:30-13:30	午休及展区参观 Lunch Break & SiP Zone

• 分论坛一 异构系统集成应用 Session 1: Heterogeneous system integration applications

  联席主席：阿里云智能集团  首席云服务器架构师和研发总监，CXL和UCle董事会成员  陈健 Co-Chairman:Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIe
  13:30-13:55	异构集成技术的发展与挑战 The Development and Challenges of Heterogeneous Integration	紫光展锐（上海）科技有限公司  封装设计部负责人  仇元红 William Qiu， Director， Unisoc (Shanghai) Technologies Co., Ltd
  13:55-14:20	Chiplet系统SiP、UCIe和3DIC技术的集成革新探索  Innovative Exploration of Integrated Solution of Chiplet System SiP, UCIe and 3DIC technology	新思科技  IP科技高级总监  王迎春博士 Dr. Wang Yingchun, Senior Director of IP Technologies, Synopsys
  14:20-14:45	芯原Chiplet技术助力设计自动驾驶和高性能计算解决方案 VeriSilicon's Chiplet Technologies Empower Autonomous Driving and High-performance Computing Solutions	芯原股份  芯片平台事业部封装工程副总裁  陈银龙 Yinlong Chen, Vice President of Packaging Engineering of the Chip Platform Division,  VeriSilicon Microelectronics (Shanghai) Co., Ltd
  14:45-15:10	3DIC多物理场挑战及应对策略 3DIC multi-physics challenges and coping strategies	安似科技（上海）有限公司  Ansys 半导体事业部技术支持总监  张书强 Shuqiang Zhang, Ansys China Semiconductor BU ACE Director, ANSYS
  15:10-15:35	突破解决2.5D/3D Chiplet设计与验证中的一些关键问题 Breakthrough solves some key problems in the design and verification of 2.5D/3D chiplets	深圳市比昂芯科技有限公司  市场总监  赵瑜斌 Yubin Zhao, Marketing Director, BTD Technology
  15:35-16:00	走向高性能芯片的必经之路，Chiplet与Die2Die接口 Chiplet & D2D IP, the road to achieve high performance chip	奇异摩尔（上海）集成电路设计有限公司  销售副总裁 马巍 Eric Ma, Sales VP, kiwimoore
  16:00-16:25	EDA使能大算力Chiplet集成系统高速互连接口信号完整性设计 EDA Enables Signal Integrity Design for High Speed Interconnects of HPC Chiplet Systems	芯和半导体科技（上海）股份有限公司  技术市场总监  黄晓波 Xiaobo Huang, Director of Technical Marketing, Xpeedic Co., Ltd

• 分论坛三 异构系统集成实现(生态圈) Session 3: Heterogeneous system integration implementation (ecosystem)

  分论坛主席：奇异摩尔（上海）集成电路设计有限公司  产品与解决方案副总裁  祝俊东 Session Chairman: Jundong Zhu, Product and Solution VP, Kiwimoore (Shanghai) IC Co., Ltd
  09:30-10:00	签到及入场 Registration and Networking
  10:00-10:25	异构系统集成实现——OSAT任重道远 Implementation of heterogeneous system integration —— OSAT is a long way to go	长电科技  高级专家  邬建勇 Jianyong Wu, Senior Expert, JCET
  10:25-10:50	UCIe+NoC——AI芯片Die-to-Die互连方案实现 UCIe+NoC——The Die-to-Die Interconnection Solution for AI Chips	上海晟联科半导体有限公司  高级市场总监  汪成喜 Chengxi Wang, Senior Marketing Director, Shanghai eTopus Technology  Co., Ltd
  10:50-11:15	Chiplet芯片技术在封装级的相关应用 Related applications of Chiplet chip technology in package level	苏州锐杰微科技集团有限公司  董事长  方家恩 Jiaen Fang, Chairman, Suzhou Rigger Micro Technologies Group Co., Ltd
  11:15-11:40	热仿真技术革新：为前沿电子产品热设计加速赋能 Innovations in Thermal Simulation Technology: Accelerating and Empowering the Thermal Design of Cutting-edge Electronic Products.	芯瑞微（上海）电子科技有限公司  高级工程师  何佳南 Jayden He, Senior Engineer, PhySim Electronic Technology Co., Ltd.
  11:40-12:05	车规高集成系统级扇出封装平台介绍 Introduction to automotive-grade highly integrated system-level fan-out packaging platform	矽磐微电子（重庆）有限公司  研发部总监  霍炎 Yan Huo, Director of R&D, SiPLP
  12:05-13:30	午休及展区参观 Lunch Break & SiP Zone
  13:30-13:55	集成电路先进封装材料研究与应用 Research and Application of Advanced Packaging Materials for Integrated Circuits	深圳先进电子材料国际创新研究院  院长助理  肖彬 Bin Xiao, Dean Assistant, Shenzhen Institute of Advanced Electronic Materials
  13:55-14:20	晶圆级先进封装的未来趋势以及微小化对于缺陷检测的影响 Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection	KLA Corporation 技术经理 裴舜 Eric Pei, Technical Manager, KLA Corporation
  14:20-14:45	SiP的新型焊接及清洗方案 New solution of SIP soldering and cleaning	欧纷泰化工（上海）有限公司  亚太区技术经理  龙泽云 Vincent Long, Technical Manager，Asia, INVENTEC Performance Chemicals (Shanghai) Co., Ltd
  14:45-15:10	华天科技：先进封装驱动智能世界发展 HT-tech： Advanced packaging drives the development of intelligent world	华天科技 TPM经理 朱浩 Hao Zhu, TPM Manager, HT-TECH
  15:10-15:35	BGA先进封装全新的植球工艺 BGA advanced package new ball planting process	广东鸿骐芯智能装备有限公司  销售总监  胡清松 Megan Hu, Sales Director, Guangdong D-TEK Intelligent Equipment Co., LTD

• 分论坛四 TGV玻璃基板关键工艺 

  主持人：厦门云天半导体科技有限公司  总监  李金喜武汉新创元半导体有限公司  副总裁  李志东 Session 4: Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd , Key processes for TGV glass substrates Master of ceremonies: Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd
  09:30-10:00	签到及入场 Registration and Networking
  10:00-10:25	玻璃通孔关键技术及应用 Key technology and application of glass through hole	三叠纪（广东）科技有限公司  电子科技大学教授  公司创始人＆董事长  张继华 Jihua Zhang, Professor, University of Electronic Science and Technology of China, Founder & Chairman of the Board of Directors of the company, 3D CHIP
  10:25-10:50	特种平板玻璃：推动半导体先进封装的关键材料 Specialty flat glass: the key material to promote semiconductor advanced packaging	肖特集团  高级经理 新业务开发  张广军 Guangjun Zhang, Senior Manager, New Business Development，SCHOTT AG
  10:50-11:15	探索 TGV（玻璃通孔技術）以实现 PLP（面板级封装）的无限可能性  Exploring TGV (Through Glass Vias) to enable Endless possibilities of PLP (Panel Level Packaging)	泛林半导体  资深商务开发总监  苏泳桦 Frank Su, Senior Director of Business Development，Lam Research
  11:15-11:40	玻璃芯基板：新一代先进的封装技术 Glass Core Substrate: Next Gen Advanced Packaging Technology	安捷利美维电子（厦门）有限责任公司  安捷利美维FCBGA总经理  汤加苗 Jiamiao Tang, General Manager, Antelimervi FCBGA, AKM Meadville Electronics (Xiamen) Co., Ltd
  11:40-12:05	先进玻璃通孔技术进展、应用与挑战 Progress, application and challenges of advanced through glass via technology	厦门云天半导体科技有限公司  总监  李金喜 Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd
  12:05-13:30	午休及展区参观 Lunch Break & SiP Zone
  13:30-13:55	高密度玻璃载板-ROS技术 High-density Glass Substrate--ROS technology	武汉新创元半导体有限公司  副总裁  李志东 Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd
  13:55-14:20	面板级TGV磁控溅射系统 PVD Sputter Tool for Large-Size Panel TGV	深圳市矩阵多元科技有限公司  董事长兼首席科学家  张晓军 Xiaojun Zhang, Chairman&Chief Scientist, Arrayed Materials (China) Co., Ltd
  14:20-14:45	玻璃通孔电镀：单片制程平台 Plating of Through-Glass-Vias：Single Panel Processing Platform	鑫巨（深圳）半导体科技有限公司  CTO  马库思·郎 LANG MARCUS ELMAR, CTO, Simetric Semiconductor Solutions Co., Ltd
  14:45-15:10	激光玻璃通孔技术助力TGV产业化 Laser glass through-hole technology promotes TGV industrialization	武汉帝尔激光科技股份有限公司  营销副总裁  李彦斌 Ben Lee, VP, Sales & Marketing, Wuhan DR Laser Technology Co., Ltd
  15:10-15:35	TGV玻璃基板关键检量测技术 Host TGV glass substrate critical measurement technology	政应(上海)科技有限公司  副总经理  施介皓 Jiehao Shi, Deputy General Manager, Zhengying (Shanghai) Technology Co., Ltd
  15:35-16:00	佛智芯TGV工艺挑战和解决方案 Fozhixin TGV process challenges and solutions	广东佛智芯微电子技术研究有限公司  首席科学家  林挺宇 Tingyu Lin, Chief Scientist, Fzxsmc